Guangzhou Minder-Hightech Co., Ltd.  

Product Name: Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550 Model NO.: mdb-7550 Trademark: minder-hightech Transport Package: Plywood Packing by Fast Express Specification: 70kg Origin: Guangzhou HS Code: 8515809090 Product Description Application:High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment,auto sensors, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126, TO-12F,TO-66,TO-251,TO-202 etc.Specification:1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 2,aluminium wire diameter:75~500μm (3~20mil)3,ultrasonic power:0-30W, two channel.can be set separately of the two point 4,bond time:10-500ms,two channel5,bond force:30-1200g,two channel6,motorized Y:0-18mm7,microscope rate:7.5 and 158,working area:Φ25mm9,light:adjustable brightness10,size:620×610×560mm11,weight:~40kg------------------------------------------------------------------------------------------------------------------------------------------------------------guangzhou minder-hightech co.,ltdcontact:shunyu.hu cellphone//:0086-15813334038